Here you can search Members and Suppliers

Micro-Hybrid Electronic GmbH

Heinrich-Hertz-Str. 8 / Industriepark
07629 Hermsdorf
Germany
Phone+49 36601 592-0
Fax+49 36601 592-110

- Manufacture of customized sensor elements and systems - Development and manufacturing customized IR sensors in single, dual and quad versions, and IR sensor systems - Development and production of customized microsystems - Electronic Manufacturing Service (EMS), Hybrid Technologies - Thick-film ceramic substrates, LTCC circuits / modules

Product range

S.01.10.26 Refrigerants

D.02.32 Micro welding

D.02.02 Thick film technology

D.02.26 Contract manufacture

S.02.09 Inductive sensing element

D.02.36 Housing production

D.01.02.04.08 Optical parameter

D.02.27 Laser processing

S.03.13 Light source

D.02.01 Strain gauge technology

S.03.07 Thickfilm paste

S.03.05 Ceramic component

M.09.05.06.01 Software

D.01.03.06 Performance verification & reliability analysis

S.01.04.02 Temperature, contactless

S.02.10 Capacitive sensing element

S.01.10.13 Methane, CH4

S.01.10.11 Sulphur dioxide, SO2

D.03.02.16 Environmental compatibility tests

D.02.35 Molding-, micro molding technology

S.03.24 Hybrid circuit

D.01.02.08.01 Thick film technology

S.01.06.15 Infrared, IR measurement

D.04.06 Training, continued education

D.02.19 Assembly and packaging

D.02.11 Microsystems technology MST / Micro-Electro-Mechanical-Systems MEMS

D.02.12 Microsensor technology

D.01.03.04 Digital simulation

D.02.33 Micro gluing

D.01.02.09.01 Signal processing and algorithm

S.01.05.02 Humidity, absolute (gas humidity), dew point

D.01.02.08.19 Assembly and packaging

S.01.10.20 Cyclic hydrocarbons

D.01.02.07.03 Passive component

D.02.30 Bonding

S.01.10.07 Carbon dioxide, CO2

D.01.02.06.07 Housing

S.02.28 Infrared, IR measuring cell

D.02.41 Other services concerning sensor systems and actuators

D.02.18 Hybrid technology

S.01.05.01 Humidity, relative (gas humidity)

D.02.31 Micro drilling

S.01.10.06 Carbon monoxide, CO

D.01.04.02 Packaging

D.02.17 Microelectronics

D.01.04.01 Assembly and packaging

D.01.03.03 Analog simulation

Back