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Leibniz Universität Hannover
IMPT - Institut für Mikroproduktionstechnik

An der Universität 2
30823 Garbsen
Germany
Phone+49 511 762-7486
Fax+49 511 762-2867

The research activities of the IMPT are the design and manufacturing of sensors and actuators based on magnetic effects, the mechanical machining and characterization of MEMS and MEMS materials. The development activities range from magnetic field sensors and measuring systems, micro motors, microoptical actuators right up to biomedical applications.

Product range

S.01.01.03 Length, displacement – range < 0.01 m

S.01.01.06 Gap, distance, sag – range < 0.01 m

S.01.01.11 Topography

S.01.01.21 Coating thickness

S.01.02.01 Force, load

S.01.02.03 Stress, strain, elongation

S.01.04.01 Temperature, with contact

S.01.05.16 Geomagnetic field, compass

S.01.08.03 Electrical current, contactless

S.02.01 Strain gauges, in general

S.02.07 Thermoresistor

S.02.09 Inductive sensing element

S.02.10 Capacitive sensing element

S.02.12 Magneto-resistive sensing element

S.03.02 Semi-finished part for sensors

S.03.44.01 Microactuator

S.03.44.04 Shape memory actuator

S.03.44.05 Electromagnetic actuator

S.03.44.08 Electrooptical actuator

S.03.44.09 Thermomechanical actuator

S.03.44.11 Micromotor

S.03.44.12 Micro-/nanopositioning, micro-/nanomanipulation

D.01.02.04.01 Geometric parameter

D.01.02.04.02 Mechanical parameter

D.01.02.04.03 Dynamic parameter

D.01.02.04.04 Thermal parameter

D.01.02.05.01 Positioning application

D.01.02.05.03 Fluidic application

D.01.02.06.02 Plastic and polymers

D.01.02.06.03 Casting compound, resin

D.01.02.06.05 Substrate material

D.01.02.06.06 Optical component

D.01.02.08.02 Thin film technology

D.01.02.08.03 Precision mechanics

D.01.02.08.08 Microstructuring of silicon

D.01.02.08.10 Microstructuring of other material (glas, ceramic, metal, polymer)

D.01.02.08.11 Lithography (E-beam-, UV-, X-ray lithography)

D.01.02.08.12 Galvanic processing

D.01.02.08.15 Replication technology (Injection molding, hot embossing)

D.01.02.08.17 Microoptics, integrated optics

D.01.02.08.19 Assembly and packaging

D.01.03.02 Component simulation, particularly with FEM

D.01.03.06 Performance verification & reliability analysis

D.01.04.01 Assembly and packaging

D.01.04.02 Packaging

D.01.04.03 Fluidic interconnection

D.01.04.04 (Micro-) handling system

D.02.01 Strain gauge technology

D.02.03 Thin film technology

D.02.10 Precision mechanics

D.02.11 Microsystems technology MST / Micro-Electro-Mechanical-Systems MEMS

D.02.12 Microsensor technology

D.02.13 Microactuator technology

D.02.14 Microfluidics, micropneumatics

D.02.15 Micromechanics, microstructuring

D.02.16 Integrated optics, microoptics

D.02.18 Hybrid technology

D.02.19 Assembly and packaging

D.02.20 Nano technology

D.02.22 Mechatronics

D.02.28 Etching technology

D.02.29 Galvanic processing

D.02.30 Bonding

D.02.35 Molding-, micro molding technology

D.02.41 Other services concerning sensor systems and actuators

D.02.43 Prototype manufacture

D.04.01 Measuring service

D.04.06 Training, continued education

D.04.15 Technology consulting

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