Details
HSG-IMIT Inst. f. Mikro- u. Informationstechnik
der Hahn-Schickard-Gesellschaft
Wilhelm-Schickard-Straße 10
D - 78052 Villingen-Schwenningen
Germany
Phone: +49 (0) 7721-943-0
Fax: +49 (0) 7721-943-210
E-Mail: info@hsg-imit.de
Web: www.hsg-imit.de
Wilhelm-Schickard-Straße 10
D - 78052 Villingen-Schwenningen
Germany
Phone: +49 (0) 7721-943-0
Fax: +49 (0) 7721-943-210
E-Mail: info@hsg-imit.de
Web: www.hsg-imit.de
HSG-IMIT is a leading R&D provider in Baden-Württemberg for Microsystems Technology in the fields of Sensors, Microfluidics, Micro Medical Technology and Lab-on-a-Chip Technologies. HSG-IMIT act as a service centre providing specific consulting, advanced training, technological services, feasibility studies, prototyping, small scale production as well as serial production in cooperation with industrial companies.
Product range
| 2.1.101 | Geometric parameters |
| 2.1.102 | Mechanical parameters |
| 2.1.103 | Dynamic parameters |
| 2.1.104 | Thermal parameters |
| 2.1.106 | Atmospheric parameters |
| 2.1.110 | Electrical and magnetic parameters |
| 2.1.112 | Biological parameters |
| 2.1.201 | Positioning |
| 2.1.203 | Fluidic applications |
| 2.1.204 | Thermal applications |
| 2.1.302 | Plastics and polymers |
| 2.1.303 | Casting compounds, resins |
| 2.1.305 | Substrate materials |
| 2.1.306 | Optical components |
| 2.1.307 | Housings |
| 2.1.401 | Active components |
| 2.1.402 | Passive components |
| 2.1.404 | Analog circuits/ASICs |
| 2.1.405 | AD-converters |
| 2.1.406 | Digital ASICs |
| 2.2.01 | Thick film technology |
| 2.2.02 | Thin film technology |
| 2.2.05 | Plastics technology |
| 2.2.07 | Microstructuring of silicon |
| 2.2.08 | Microstructuring of other materials [glas, ceramic, metals, polymers] |
| 2.2.11 | Replication technologies [Injection molding, hot embossing] |
| 2.2.13 | microoptics, Integrated optics |
| 2.2.14 | Assembly and interconnection, packaging |
| 2.3.02 | Component simulation, especially using FEM |
| 2.3.03 | Analog circuit simulation |
| 2.3.04 | Digital circuit simulation |
| 2.3.05 | System simulation |
| 2.3.06 | Performance verification & reliability assessment |
| 2.4.01 | Assembly and connection |
| 2.4.02 | Packaging |
| 2.4.03 | Fluidic interconnections |
| 2.4.05 | Communication interfaces |
| 2.4.06 | Signal processing and algorithms |
| 3.3.02 | Thick film technology |
| 3.3.06 | CMOS technology |
| 3.3.07 | Ceramic technology |
| 3.3.08 | Plastics technology |
| 3.3.11 | Microsystems technology |
| 3.3.12 | Microsensor technology |
| 3.3.13 | Microactuator technology |
| 3.3.14 | Microfluidics, micropneumatics |
| 3.3.15 | Micromechanics, microstructuring |
| 3.3.17 | Microelectronics |
| 3.3.18 | Hybrid technology |
| 3.3.19 | Assembly and connection, packaging |
| 3.3.22 | Mechatronics |
| 3.3.29 | ASICs |
| 3.3.60 | Laser processing |
| 3.3.61 | Etching |
| 3.3.63 | Bonding |
| 3.3.64 | Micro drilling |
| 3.3.65 | Micro welding |
| 3.3.66 | Micro gluing |
| 3.3.67 | Micro cutting |
| 3.3.68 | Capping -, micro capping technologies |
| 3.3.73 | Housing production |
| 4.04 | Customised measurement services |
| 4.22 | Technology consulting |

