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Technische Universität Berlin FSP TDM
Gustav-Meyer-Allee 25
D - 13355 Berlin
Germany
Phone: +49 (0) 30-314-72882
Fax: +49 (0) 30-314-72835
E-Mail: karlheinz.bock@tu-berlin.de
Web: www.mst.tu-berlin.de/becap/
D - 13355 Berlin
Germany
Phone: +49 (0) 30-314-72882
Fax: +49 (0) 30-314-72835
E-Mail: karlheinz.bock@tu-berlin.de
Web: www.mst.tu-berlin.de/becap/
The Research Center "Microperipheric Technologies" of the TU Berlin develops packaging concepts for sensors and miniaturized systems. Beside the integration of sensors and MEMS the center focusses on packaging for wireless, RF and optical systems. Experts in the field of design, reliability and environmental issues are integrated in the R&D work.
Product range
| 2.2.02 | Thin film technology |
| 2.2.07 | Microstructuring of silicon |
| 2.2.08 | Microstructuring of other materials [glas, ceramic, metals, polymers] |
| 2.2.10 | Galvanic processing |
| 2.2.12 | Fibre optics |
| 2.2.14 | Assembly and interconnection, packaging |
| 2.3.01 | Process and technology simulation |
| 2.3.02 | Component simulation, especially using FEM |
| 2.3.06 | Performance verification & reliability assessment |
| 2.4.01 | Assembly and connection |
| 2.4.02 | Packaging |
| 3.3.11 | Microsystems technology |
| 3.3.19 | Assembly and connection, packaging |
| 3.3.68 | Capping -, micro capping technologies |
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