Details
Albert-Ludwigs-Universität Freiburg
IMTEK – Institut für Mikrosystemtechnik
Georges-Köhler-Allee, Geb. 103
D - 79110 Freiburg
Germany
Phone: +49 (0) 761-203-73211
Fax: +49 (0) 761-203-73299
E-Mail: mbaumann@imtek.uni-freiburg.de
Web: www.imtek.uni-freiburg.de
Georges-Köhler-Allee, Geb. 103
D - 79110 Freiburg
Germany
Phone: +49 (0) 761-203-73211
Fax: +49 (0) 761-203-73299
E-Mail: mbaumann@imtek.uni-freiburg.de
Web: www.imtek.uni-freiburg.de
R&D on MEMS, microoptics, microfluidics, sensors and actuators. Silicon micromachining, ASICs, thin films, assembly and packaging as well as polymer and ceramic microparts. New methods for design, simulation, testing and characterisation. Applications in life science, medicine as well as in traffic systems.
Product range
| 1.1.8020 | Electrochemical conductivity |
| 1.1.8040 | Dissolved oxygen |
| 1.1.8060 | Ion-selective sensors [e. g. Na+, Cl-] |
| 1.1.8180 | Concentration [in liquids] |
| 1.1.8270 | Nitrous Gases |
| 1.1.8350 | Alcohol |
| 1.1.8360 | Hydrocarbon |
| 1.1.8770 | Glucose |
| 1.1.8780 | Lactate |
| 2.1.101 | Geometric parameters |
| 2.1.102 | Mechanical parameters |
| 2.1.103 | Dynamic parameters |
| 2.1.104 | Thermal parameters |
| 2.1.105 | Caloric parameters |
| 2.1.106 | Atmospheric parameters |
| 2.1.107 | Meteorological parameters |
| 2.1.108 | Optical parameters |
| 2.1.109 | Acoustical parameters |
| 2.1.110 | Electrical and magnetic parameters |
| 2.1.111 | Chemical parameters |
| 2.1.112 | Biological parameters |
| 2.1.113 | Medical parameters |
| 2.1.203 | Fluidic applications |
| 2.1.204 | Thermal applications |
| 2.1.301 | Ceramic materials |
| 2.1.302 | Plastics and polymers |
| 2.1.303 | Casting compounds, resins |
| 2.1.304 | Semi-finished parts |
| 2.1.305 | Substrate materials |
| 2.1.306 | Optical components |
| 2.1.307 | Housings |
| 2.1.399 | Other Materials and Components [Semiconductors] |
| 2.1.401 | Active components |
| 2.1.402 | Passive components |
| 2.1.403 | Connectors |
| 2.1.404 | Analog circuits/ASICs |
| 2.1.405 | AD-converters |
| 2.1.406 | Digital ASICs |
| 2.1.407 | Mixed-signal ASICs |
| 2.2.01 | Thick film technology |
| 2.2.02 | Thin film technology |
| 2.2.03 | Precision mechanics |
| 2.2.04 | Ceramic technology |
| 2.2.05 | Plastics technology |
| 2.2.06 | CMOS-technology or technology steps |
| 2.2.07 | Microstructuring of silicon |
| 2.2.08 | Microstructuring of other materials [glas, ceramic, metals, polymers] |
| 2.2.09 | Lithography [E-beam-, UV-, X-ray lithography] |
| 2.2.10 | Galvanic processing |
| 2.2.11 | Replication technologies [Injection molding, hot embossing] |
| 2.2.12 | Fibre optics |
| 2.2.13 | microoptics, Integrated optics |
| 2.2.14 | Assembly and interconnection, packaging |
| 2.3.01 | Process and technology simulation |
| 2.3.02 | Component simulation, especially using FEM |
| 2.3.03 | Analog circuit simulation |
| 2.3.04 | Digital circuit simulation |
| 2.3.05 | System simulation |
| 2.3.06 | Performance verification & reliability assessment |
| 2.4.01 | Assembly and connection |
| 2.4.02 | Packaging |
| 2.4.03 | Fluidic interconnections |
| 2.4.04 | [Micro-] Handling systems |
| 2.4.05 | Communication interfaces |
| 2.4.06 | Signal processing and algorithms |
| 2.4.99 | Other System Integration [Medical AVT] |
| 4.22 | Technology consulting |
| 4.30 | Training, continued education |
| 4.31 | Training-on-the-project |

