Details
CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH
Konrad-Zuse-Straße 14
D - 99099 Erfurt
Germany
Phone: +49 (0) 361-663-1410
Fax: +49 (0) 361-663-1413
E-Mail: info@cismst.de
Web: www.cismst.de
D - 99099 Erfurt
Germany
Phone: +49 (0) 361-663-1410
Fax: +49 (0) 361-663-1413
E-Mail: info@cismst.de
Web: www.cismst.de
Research/Development/Prototyping of optical, piezoresistive, capacitive sensors and microsystems. Si-based photodiodes, photomultiplier, transceivers, radiation detectors, pressure transducers, dew-point and condensation sensors. Wafer processing, assembly and packaging. Joint application centre amos with Fraunhofer IOF: Combining MEMS, Optics and Sensors.
Product range
| 1.1.1120 | Roughness, coarseness |
| 1.1.2104 | Pressure [gauge] – Measuring Error < 0,5 % *) |
| 1.1.2120 | Minimum pressure < 20 mbar |
| 1.1.3110 | Acceleration, vibration, shock |
| 1.1.3120 | Oscillation, amplitude, vibration speed |
| 1.1.3140 | Particle counting |
| 1.1.3150 | Radioactivity |
| 1.1.3260 | Volume Flow [in liquids] |
| 1.1.5010 | Humidity rel. [Gas humidity] |
| 1.1.5020 | Humidity abs. [Gas humidity], dew point |
| 1.1.5050 | Room climate |
| 1.1.5250 | Atmospheric gas concentration [O3, NO2, SO2,...] |
| 1.1.6020 | Radiation, radiated energy, density |
| 1.1.6030 | Turbidity, absorption, transmission |
| 1.1.6050 | Reflection, diffuse reflection, brightness |
| 1.1.6060 | Fluorescence |
| 1.1.6070 | Optical density |
| 1.1.6200 | Spectral analysis |
| 1.1.8270 | Nitrous Gases |
| 1.1.8460 | Gas bubbles in liquids |
| 1.1.8730 | Pulsation |
| 1.1.8740 | Blood flow |
| 1.1.8770 | Glucose |
| 1.1.8950 | Biological parameters [SpO2] |
| 1.2.0020 | Piezoresistive elements |
| 1.2.0090 | Capacitive elements |
| 1.2.0200 | Photo cells, photo sensors |
| 1.2.0210 | Fibre-optic sensors |
| 1.2.0220 | Optoelectronic elements |
| 1.2.0225 | Optical Interferometer or Interference Sensor Elements |
| 1.2.0600 | Sensor-Arrays |
| 1.3.1000 | Microswitches |
| 1.4.0010 | Micro-Nano-Interfaces [MNI] |
| 1.4.0201 | Optical components |
| 2.1.101 | Geometric parameters |
| 2.1.102 | Mechanical parameters |
| 2.1.103 | Dynamic parameters |
| 2.1.106 | Atmospheric parameters |
| 2.1.108 | Optical parameters |
| 2.1.110 | Electrical and magnetic parameters |
| 2.1.111 | Chemical parameters |
| 2.1.112 | Biological parameters |
| 2.1.113 | Medical parameters |
| 2.2.02 | Thin film technology |
| 2.2.07 | Microstructuring of silicon |
| 2.2.14 | Assembly and interconnection, packaging |
| 2.3.06 | Performance verification & reliability assessment |
| 2.4.01 | Assembly and connection |
| 2.4.02 | Packaging |
| 3.1 | Sensoric, specific |
| 3.2 | Actuators |
| 3.3.03 | Thin film technology |
| 3.3.04 | Semiconductor Technology |
| 3.3.11 | Microsystems technology |
| 3.3.12 | Microsensor technology |
| 3.3.13 | Microactuator technology |
| 3.3.14 | Microfluidics, micropneumatics |
| 3.3.15 | Micromechanics, microstructuring |
| 3.3.19 | Assembly and connection, packaging |
| 3.3.21 | Mikro-nano-interface technology |
| 3.3.61 | Etching |
| 3.3.63 | Bonding |
| 3.3.66 | Micro gluing |
| 3.3.68 | Capping -, micro capping technologies |
| 4.03 | Testing Service [Quality, Security] |
| 4.04 | Customised measurement services |
| 4.30 | Training, continued education |
| 4.31 | Training-on-the-project |

