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Details

CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH

Konrad-Zuse-Straße 14
D - 99099 Erfurt
Germany

Phone: +49 (0) 361-663-1410
Fax: +49 (0) 361-663-1413

E-Mail: info@cismst.de
Web: www.cismst.de
2010 CiS Logo

Research/Development/Prototyping of optical, piezoresistive, capacitive sensors and microsystems. Si-based photodiodes, photomultiplier, transceivers, radiation detectors, pressure transducers, dew-point and condensation sensors. Wafer processing, assembly and packaging. Joint application centre amos with Fraunhofer IOF: Combining MEMS, Optics and Sensors.

Product range

1.1.1120Roughness, coarseness
1.1.2104Pressure [gauge] – Measuring Error < 0,5 % *)
1.1.2120Minimum pressure < 20 mbar
1.1.3110Acceleration, vibration, shock
1.1.3120Oscillation, amplitude, vibration speed
1.1.3140Particle counting
1.1.3150Radioactivity
1.1.3260Volume Flow [in liquids]
1.1.5010Humidity rel. [Gas humidity]
1.1.5020Humidity abs. [Gas humidity], dew point
1.1.5050Room climate
1.1.5250Atmospheric gas concentration [O3, NO2, SO2,...]
1.1.6020Radiation, radiated energy, density
1.1.6030Turbidity, absorption, transmission
1.1.6050Reflection, diffuse reflection, brightness
1.1.6060Fluorescence
1.1.6070Optical density
1.1.6200Spectral analysis
1.1.8270Nitrous Gases
1.1.8460Gas bubbles in liquids
1.1.8730Pulsation
1.1.8740Blood flow
1.1.8770Glucose
1.1.8950Biological parameters [SpO2]
1.2.0020Piezoresistive elements
1.2.0090Capacitive elements
1.2.0200Photo cells, photo sensors
1.2.0210Fibre-optic sensors
1.2.0220Optoelectronic elements
1.2.0225Optical Interferometer or Interference Sensor Elements
1.2.0600Sensor-Arrays
1.3.1000Microswitches
1.4.0010Micro-Nano-Interfaces [MNI]
1.4.0201Optical components
2.1.101Geometric parameters
2.1.102Mechanical parameters
2.1.103Dynamic parameters
2.1.106Atmospheric parameters
2.1.108Optical parameters
2.1.110Electrical and magnetic parameters
2.1.111Chemical parameters
2.1.112Biological parameters
2.1.113Medical parameters
2.2.02Thin film technology
2.2.07Microstructuring of silicon
2.2.14Assembly and interconnection, packaging
2.3.06Performance verification & reliability assessment
2.4.01Assembly and connection
2.4.02Packaging
3.1Sensoric, specific
3.2Actuators
3.3.03Thin film technology
3.3.04Semiconductor Technology
3.3.11Microsystems technology
3.3.12Microsensor technology
3.3.13Microactuator technology
3.3.14Microfluidics, micropneumatics
3.3.15Micromechanics, microstructuring
3.3.19Assembly and connection, packaging
3.3.21Mikro-nano-interface technology
3.3.61Etching
3.3.63Bonding
3.3.66Micro gluing
3.3.68Capping -, micro capping technologies
4.03Testing Service [Quality, Security]
4.04Customised measurement services
4.30Training, continued education
4.31Training-on-the-project
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The Teaser

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