Details
Leibniz Universität Hannover
IMPT - Institut für Mikroproduktionstechnik
An der Universität 2
D - 30823 Garbsen
Germany
Phone: +49 (0) 511-762-7486
Fax: +49 (0) 511-762-2867
E-Mail: wurz@impt.uni-hannover.de
Web: www.impt.uni-hannover.de
An der Universität 2
D - 30823 Garbsen
Germany
Phone: +49 (0) 511-762-7486
Fax: +49 (0) 511-762-2867
E-Mail: wurz@impt.uni-hannover.de
Web: www.impt.uni-hannover.de
The research activities of the IMPT are the design and manufacturing of sensors and actuators based on magnetic effects, the mechanical machining and characterization of MEMS and MEMS materials. The development activities range from magnetic field sensors and measuring systems, micro motors, microoptical actuators right up to biomedical applications.
Product range
| 1.1.1030 | Length, displacement – Range < 0,01 m |
| 1.1.1060 | Gap, distance, sag – Range < 0,01 m |
| 1.1.1110 | Topography |
| 1.1.1210 | Coating thickness |
| 1.1.2010 | Force |
| 1.1.2030 | Stress, strain, elongation |
| 1.1.4010 | Temperature [with contact] |
| 1.1.5700 | Earth`s magnetic field, compass |
| 1.1.7030 | Current [without contact] |
| 1.2.0010 | Strain gauges |
| 1.2.0050 | Thermoresistor |
| 1.2.0080 | Inductive elements |
| 1.2.0090 | Capacitive elements |
| 1.2.0110 | Magneto-Resistive Elements |
| 1.2.0600 | Sensor-Arrays |
| 1.3.0010 | Microactuators |
| 1.3.0040 | Shape memory actuators |
| 1.3.0050 | Electromagnetic actuators |
| 1.3.0080 | Electrooptical actuators |
| 1.3.0200 | Thermalmechanical actuators |
| 1.3.2000 | Micromotors |
| 1.3.2010 | Micro/nanopositioning, micro/nanomanipulation |
| 2.1.101 | Geometric parameters |
| 2.1.102 | Mechanical parameters |
| 2.1.103 | Dynamic parameters |
| 2.1.104 | Thermal parameters |
| 2.1.201 | Positioning |
| 2.1.203 | Fluidic applications |
| 2.1.302 | Plastics and polymers |
| 2.1.303 | Casting compounds, resins |
| 2.1.304 | Semi-finished parts |
| 2.1.305 | Substrate materials |
| 2.1.306 | Optical components |
| 2.2.02 | Thin film technology |
| 2.2.03 | Precision mechanics |
| 2.2.07 | Microstructuring of silicon |
| 2.2.08 | Microstructuring of other materials [glas, ceramic, metals, polymers] |
| 2.2.09 | Lithography [E-beam-, UV-, X-ray lithography] |
| 2.2.10 | Galvanic processing |
| 2.2.11 | Replication technologies [Injection molding, hot embossing] |
| 2.2.13 | microoptics, Integrated optics |
| 2.2.14 | Assembly and interconnection, packaging |
| 2.3.02 | Component simulation, especially using FEM |
| 2.3.06 | Performance verification & reliability assessment |
| 2.4.01 | Assembly and connection |
| 2.4.02 | Packaging |
| 2.4.03 | Fluidic interconnections |
| 2.4.04 | [Micro-] Handling systems |
| 3.1 | Sensoric, specific |
| 3.2 | Actuators |
| 3.3.01 | Strain gauge technology |
| 3.3.03 | Thin film technology |
| 3.3.10 | Precision mechanics |
| 3.3.11 | Microsystems technology |
| 3.3.12 | Microsensor technology |
| 3.3.13 | Microactuator technology |
| 3.3.14 | Microfluidics, micropneumatics |
| 3.3.15 | Micromechanics, microstructuring |
| 3.3.16 | Integrated optics, microoptics |
| 3.3.18 | Hybrid technology |
| 3.3.19 | Assembly and connection, packaging |
| 3.3.20 | Nano Technology |
| 3.3.21 | Mikro-nano-interface technology |
| 3.3.22 | Mechatronics |
| 3.3.61 | Etching |
| 3.3.62 | Galvanic processing |
| 3.3.63 | Bonding |
| 3.3.68 | Capping -, micro capping technologies |
| 4.04 | Customised measurement services |
| 4.22 | Technology consulting |
| 4.30 | Training, continued education |

