Details
EUROCOMP ELEKTRONIK GMBH
Vertretung der VECTRON International
Nordlicher Park 17
D - 61231 Bad Nauheim
Germany
Phone: +49 (0) 6032-9308-0
Fax: +49 (0) 6032-9308-30
E-Mail: s.landau@eurocomp.de
Web: www.eurocomp.de
Nordlicher Park 17
D - 61231 Bad Nauheim
Germany
Phone: +49 (0) 6032-9308-0
Fax: +49 (0) 6032-9308-30
E-Mail: s.landau@eurocomp.de
Web: www.eurocomp.de
Vectron International is both a product manufacturer and a solutions provider, leading with its unique technology but always prepared to design and engineer custom solutions, where required. Vectron's core competencies combines its classic crystal and SAW technology with sophiticated integrated circuits and advanced packaging.
Product range
| 1.1.2030 | Stress, strain, elongation |
| 1.1.2104 | Pressure [gauge] – Measuring Error < 0,5 % *) |
| 1.1.2230 | Viscosity |
| 1.1.2400 | Torque |
| 1.1.4010 | Temperature [with contact] |
| 1.1.5010 | Humidity rel. [Gas humidity] |
| 1.1.7060 | Electrical conductivity |
| 1.1.7070 | Electrical resistance |
| 1.1.7080 | Inductance |
| 1.1.8020 | Electrochemical conductivity |
| 1.1.8250 | Carbon monoxid |
| 1.1.8260 | Carbon dioxide |
| 1.1.8270 | Nitrous Gases |
| 1.1.8280 | Hydrogen sulphide |
| 1.1.8290 | Sulphur dioxide |
| 1.1.8300 | Ammonia |
| 1.1.8310 | Methane |
| 1.1.8350 | Alcohol |
| 1.1.8360 | Hydrocarbon |
| 1.1.8440 | Multigas analysis [Electronic nose] |
| 1.2.0010 | Strain gauges |
| 1.2.0020 | Piezoresistive elements |
| 1.2.0030 | Thinfilm elements |
| 1.2.0040 | Thick film elements |
| 1.2.0100 | Piezoelectric elements |
| 1.2.0500 | Semiconductor Gas sensor elements |
| 1.4.0001 | Special materials |
| 1.4.0002 | Semi-finished parts |
| 1.4.0003 | Wafer, polished |
| 1.4.0051 | Casting compounds, resins |
| 1.4.0301 | ASICs |
| 1.4.0302 | Hybrid circuits |
| 1.4.0500 | Housings |
| 1.4.0501 | Connectors |
| 1.4.0502 | PCBs |
| 3.3.04 | Semiconductor Technology |
| 3.3.11 | Microsystems technology |
| 3.3.12 | Microsensor technology |
| 3.3.15 | Micromechanics, microstructuring |
| 3.3.17 | Microelectronics |
| 3.3.18 | Hybrid technology |
| 3.3.19 | Assembly and connection, packaging |
| 3.3.29 | ASICs |
| 3.3.30 | SMD [Contact Manufacture] |
| 3.3.32 | Software |
| 3.3.33 | CAD, CAE |
| 3.3.61 | Etching |
| 3.3.63 | Bonding |
| 3.3.64 | Micro drilling |
| 3.3.65 | Micro welding |
| 3.3.66 | Micro gluing |
| 3.3.73 | Housing production |
| 3.3.74 | Connector, cable technologies |

