Details
Micro-Hybrid Electronic GmbH
Heinrich-Hertz-Straße 8
D - 07629 Hermsdorf
Germany
Phone: +49 (0) 36601-592-0
Fax: +49 (0) 36601-592-110
E-Mail: contact@micro-hybrid.de
Web: www.micro-hybrid.de
D - 07629 Hermsdorf
Germany
Phone: +49 (0) 36601-592-0
Fax: +49 (0) 36601-592-110
E-Mail: contact@micro-hybrid.de
Web: www.micro-hybrid.de
- Manufacture of customized sensor elements and systems
- Development and manufacturing customized IR sensors in single, dual and quad versions, and IR sensor systems
- Development and production of customized microsystems
- Electronic Manufacturing Service (EMS), Hybrid Technologies
- Thick-film ceramic substrates, LTCC circuits / modules
Product range
| 1.1.4020 | Temperature [without contact], infrared radiation |
| 1.1.5010 | Humidity rel. [Gas humidity] |
| 1.1.5020 | Humidity abs. [Gas humidity], dew point |
| 1.1.5250 | Atmospheric gas concentration [O3, NO2, SO2,...] |
| 1.1.6250 | IR measurement |
| 1.1.8250 | Carbon monoxid |
| 1.1.8260 | Carbon dioxide |
| 1.1.8290 | Sulphur dioxide |
| 1.1.8310 | Methane |
| 1.1.8350 | Alcohol |
| 1.1.8360 | Hydrocarbon |
| 1.1.8390 | Cyclic hydrocarbon |
| 1.1.8440 | Multigas analysis [Electronic nose] |
| 1.2.0080 | Inductive elements |
| 1.2.0090 | Capacitive elements |
| 1.2.0240 | IR measuring cells |
| 1.2.0600 | Sensor-Arrays |
| 1.4.0005 | Ceramic components |
| 1.4.0009 | Thickfilm pastes |
| 1.4.0200 | Light sources |
| 1.4.0302 | Hybrid circuits |
| 1.4.0500 | Housings |
| 2.1.108 | Optical parameters |
| 2.1.402 | Passive components |
| 2.2.01 | Thick film technology |
| 2.2.14 | Assembly and interconnection, packaging |
| 2.3.03 | Analog circuit simulation |
| 2.3.04 | Digital circuit simulation |
| 2.3.06 | Performance verification & reliability assessment |
| 2.4.01 | Assembly and connection |
| 2.4.02 | Packaging |
| 2.4.06 | Signal processing and algorithms |
| 3.1 | Sensoric, specific |
| 3.3.01 | Strain gauge technology |
| 3.3.02 | Thick film technology |
| 3.3.11 | Microsystems technology |
| 3.3.12 | Microsensor technology |
| 3.3.17 | Microelectronics |
| 3.3.18 | Hybrid technology |
| 3.3.19 | Assembly and connection, packaging |
| 3.3.30 | SMD [Contact Manufacture] |
| 3.3.32 | Software |
| 3.3.33 | CAD, CAE |
| 3.3.60 | Laser processing |
| 3.3.63 | Bonding |
| 3.3.64 | Micro drilling |
| 3.3.65 | Micro welding |
| 3.3.66 | Micro gluing |
| 3.3.68 | Capping -, micro capping technologies |
| 3.3.73 | Housing production |
| 4.05 | Environmental compatibility tests |
| 4.30 | Training, continued education |

