Details
Institut für Mikroelektronik Stuttgart
Allmandring 30a
D - 70569 Stuttgart
Germany
Phone: +49 (0) 711-218 55-0
Fax: +49 (0) 711-21855 111
E-Mail: asics@ims-chips.de
Web: www.ims-chips.de
D - 70569 Stuttgart
Germany
Phone: +49 (0) 711-218 55-0
Fax: +49 (0) 711-21855 111
E-Mail: asics@ims-chips.de
Web: www.ims-chips.de
The Institut für Mikroelektronik Stuttgart (IMS CHIPS) carries out research in silicon technology, ASICs, nanopatterning and image sensor technology. It offers a variety of services for small- and medium-sized companies including affordable small volume ASIC production.
Product range
| 1.1.2030 | Stress, strain, elongation |
| 1.1.3100 | Wavelength, frequency |
| 1.1.3130 | Pulse counting, event counting |
| 1.1.3270 | Flow velocity |
| 1.1.3300 | Angular, rotational velocity |
| 1.1.3310 | Angular, rotational acceleration |
| 1.1.3320 | Rotational speed [r.p.m] |
| 1.1.3330 | Angular momentum |
| 1.1.4020 | Temperature [without contact], infrared radiation |
| 1.1.4030 | Temperature distribution [e. g. IR cameras] |
| 1.1.6010 | Light intensity, illumination intensity |
| 1.1.6020 | Radiation, radiated energy, density |
| 1.1.6200 | Spectral analysis |
| 1.1.6250 | IR measurement |
| 1.1.7010 | Voltage |
| 1.1.7020 | Current [with contact] |
| 1.1.7030 | Current [without contact] |
| 1.1.7040 | Charge, capacity |
| 1.1.7050 | Electrical, magnetic field |
| 1.1.7060 | Electrical conductivity |
| 1.1.7070 | Electrical resistance |
| 1.1.9100 | 2D-/3D-Figure analysis |
| 1.2.0020 | Piezoresistive elements |
| 1.2.0030 | Thinfilm elements |
| 1.2.0050 | Thermoresistor |
| 1.2.0080 | Inductive elements |
| 1.2.0090 | Capacitive elements |
| 1.2.0110 | Magneto-Resistive Elements |
| 1.2.0120 | Hall elements |
| 1.2.0190 | Thermocouples |
| 1.2.0200 | Photo cells, photo sensors |
| 1.2.0220 | Optoelectronic elements |
| 1.2.0240 | IR measuring cells |
| 1.2.0510 | Semiconductor Temperature Elements |
| 1.2.0600 | Sensor-Arrays |
| 1.3.0020 | Piezoelectric actuators |
| 1.3.0070 | Electrostatic actuators |
| 1.4.0001 | Special materials |
| 1.4.0003 | Wafer, polished |
| 1.4.0010 | Micro-Nano-Interfaces [MNI] |
| 1.4.0030 | Special glasses |
| 1.4.0050 | Protective coatings |
| 1.4.0301 | ASICs |
| 1.4.0302 | Hybrid circuits |
| 1.4.0560 | Communication modules, wireless |
| 1.4.0561 | Communication modules, wire-bound |
| 2.1.108 | Optical parameters |
| 2.1.110 | Electrical and magnetic parameters |
| 2.1.111 | Chemical parameters |
| 2.1.112 | Biological parameters |
| 2.1.113 | Medical parameters |
| 2.1.306 | Optical components |
| 2.1.404 | Analog circuits/ASICs |
| 2.1.406 | Digital ASICs |
| 2.1.407 | Mixed-signal ASICs |
| 2.2.06 | CMOS-technology or technology steps |
| 2.2.07 | Microstructuring of silicon |
| 2.2.08 | Microstructuring of other materials [glas, ceramic, metals, polymers] |
| 2.2.09 | Lithography [E-beam-, UV-, X-ray lithography] |
| 2.3.03 | Analog circuit simulation |
| 2.3.04 | Digital circuit simulation |
| 2.3.05 | System simulation |
| 2.3.06 | Performance verification & reliability assessment |
| 2.4.01 | Assembly and connection |
| 2.4.02 | Packaging |
| 2.4.05 | Communication interfaces |
| 2.4.06 | Signal processing and algorithms |
| 3.3.04 | Semiconductor Technology |
| 3.3.06 | CMOS technology |
| 3.3.11 | Microsystems technology |
| 3.3.12 | Microsensor technology |
| 3.3.15 | Micromechanics, microstructuring |
| 3.3.16 | Integrated optics, microoptics |
| 3.3.17 | Microelectronics |
| 3.3.19 | Assembly and connection, packaging |
| 3.3.20 | Nano Technology |
| 3.3.21 | Mikro-nano-interface technology |
| 3.3.29 | ASICs |
| 4.20 | Management consultance |
| 4.24 | Consultance in financial-support programmes |
| 4.30 | Training, continued education |
| 4.30 | Training, continued education |
| 4.31 | Training-on-the-project |

