Details
Fraunhofer-Gesellschaft
Forschungsplanung
Hansastr. 27c
D - 80686 München
Germany
Phone: +49 (0) 89-1205-01
Fax: +49 (0) 89-1205-7531
E-Mail: info@fraunhofer.de
Web: www.fraunhofer.de
Hansastr. 27c
D - 80686 München
Germany
Phone: +49 (0) 89-1205-01
Fax: +49 (0) 89-1205-7531
E-Mail: info@fraunhofer.de
Web: www.fraunhofer.de
The Fraunhofer-Gesellschaft undertakes applied research of direct utility to private and public enterprise and of wide benefit to society. More than 80 research units, including 56 Fraunhofer Institutes, at 40 different locations in Germany, the majority of the 13, 000 staff are qualified scientists and engineers, € 1.3 billion annual research budget totalling.
Product range
| 2.1.101 | Geometric parameters |
| 2.1.102 | Mechanical parameters |
| 2.1.103 | Dynamic parameters |
| 2.1.104 | Thermal parameters |
| 2.1.105 | Caloric parameters |
| 2.1.106 | Atmospheric parameters |
| 2.1.107 | Meteorological parameters |
| 2.1.108 | Optical parameters |
| 2.1.109 | Acoustical parameters |
| 2.1.110 | Electrical and magnetic parameters |
| 2.1.114 | Image processing |
| 2.1.203 | Fluidic applications |
| 2.1.204 | Thermal applications |
| 2.1.301 | Ceramic materials |
| 2.1.302 | Plastics and polymers |
| 2.1.303 | Casting compounds, resins |
| 2.1.304 | Semi-finished parts |
| 2.1.305 | Substrate materials |
| 2.1.306 | Optical components |
| 2.1.401 | Active components |
| 2.1.402 | Passive components |
| 2.1.403 | Connectors |
| 2.1.404 | Analog circuits/ASICs |
| 2.1.405 | AD-converters |
| 2.1.406 | Digital ASICs |
| 2.1.407 | Mixed-signal ASICs |
| 2.2.01 | Thick film technology |
| 2.2.02 | Thin film technology |
| 2.2.03 | Precision mechanics |
| 2.2.04 | Ceramic technology |
| 2.2.05 | Plastics technology |
| 2.2.06 | CMOS-technology or technology steps |
| 2.2.07 | Microstructuring of silicon |
| 2.2.08 | Microstructuring of other materials [glas, ceramic, metals, polymers] |
| 2.2.09 | Lithography [E-beam-, UV-, X-ray lithography] |
| 2.2.10 | Galvanic processing |
| 2.2.11 | Replication technologies [Injection molding, hot embossing] |
| 2.2.12 | Fibre optics |
| 2.2.13 | microoptics, Integrated optics |
| 2.2.14 | Assembly and interconnection, packaging |
| 2.3.01 | Process and technology simulation |
| 2.3.03 | Analog circuit simulation |
| 2.3.04 | Digital circuit simulation |
| 2.3.05 | System simulation |
| 2.3.06 | Performance verification & reliability assessment |
| 2.4.01 | Assembly and connection |
| 2.4.02 | Packaging |
| 2.4.03 | Fluidic interconnections |
| 2.4.04 | [Micro-] Handling systems |
| 2.4.05 | Communication interfaces |
| 2.4.06 | Signal processing and algorithms |

