SENSOR Suppliers

Know-how Transfer

• 2.1Development, Characterization and Optimization of ...
  • 2.1.1Sensors for ...
    • 2.1.101geometric parameters
    • 2.1.102mechanical parameters
    • 2.1.103dynamic parameters
    • 2.1.104thermal parameters
    • 2.1.105caloric parameters
    • 2.1.106atmospheric parameters
    • 2.1.107meteorological parameters
    • 2.1.108optical parameters
    • 2.1.109image processing
    • 2.1.110acoustic parameters
    • 2.1.111electrical and magnetic parameters
    • 2.1.112chemical parameters
    • 2.1.113biological parameters
    • 2.1.114medical parameters
    • 2.1.115haptic parameters
    • 2.1.120mass, weight, weighing, dosing
  • 2.1.2Actuators for ...
    • 2.1.201Positioning
    • 2.1.202dynamic applications (e.g. damping of vibrations)
    • 2.1.203fluidic applications
    • 2.1.204thermal applications
  • 2.1.3Materials and components
    • 2.1.301ceramic materials
    • 2.1.302plastics and polymers
    • 2.1.303casting compounds, resins
    • 2.1.304semi-finished parts
    • 2.1.305substrate materials
    • 2.1.306optical components
    • 2.1.307housings
    • 2.1.310optical lenses
    • 2.1.312lasers
    • 2.1.3203D-MID
    • 2.1.330semiconductors
    • 2.1.340resistors
    • 2.1.350magnetic materials
  • 2.1.4Electronic components, modules and circuits
    • 2.1.401Active components
    • 2.1.402Passive components
    • 2.1.403Connectors
    • 2.1.404Analog circuits/ASICs
    • 2.1.405AD-converters
    • 2.1.406Digital ASICs
    • 2.1.407Mixed-signal ASICs
    • 2.1.410Electronic sensorinterfaces
    • 2.1.420FPGA design
    • 2.1.430LF/HF transmitter/receiver
    • 2.1.440General electronic HW,SW
• 2.2Technology development
  • 2.2.01Thick film technology
  • 2.2.02Thin film technology
  • 2.2.03Precision mechanics
  • 2.2.04Ceramic technology
  • 2.2.05Plastics technology
  • 2.2.07roll-to-roll (R2R) structuring
  • 2.2.10CMOS-technology or technology steps
  • 2.2.12Microstructuring of silicon
  • 2.2.13Micro Systems Technologies, MEMS
  • 2.2.14Microstructuring of other materials [glas, ceramic, metals, polymers]
  • 2.2.15Lithography [E-beam-, UV-, X-ray lithography]
  • 2.2.20Galvanic processing
  • 2.2.22Plasma-/surface technology
  • 2.2.23LTCC
  • 2.2.25Replication technologies [Injection molding, hot embossing]
  • 2.2.30Fibre optics
  • 2.2.31microoptics, integrated optics
  • 2.2.35Optoelectronic integrated circuits, OEICs
  • 2.2.40Assembly and interconnection, packaging
  • 2.2.50Fieldbus Technologies, wireless, embedded controllers, FPGA
  • 2.2.60Micro fluidic devices
• 2.3Modelling and simulation
  • 2.3.01Process and technology simulation
  • 2.3.02Component simulation, especially using FEM
  • 2.3.03Analog circuit simulation
  • 2.3.04Digital circuit simulation
  • 2.3.06System simulation
  • 2.3.10Performance verification & reliability assessment
  • 2.3.20Optics simulation
  • 2.3.30HiL Hardware-in-the-Loop Simulation
  • 2.3.40Magnetic field simulation
• 2.4System integration
  • 2.4.01Assembly and connection
  • 2.4.02Packaging
  • 2.4.03Fluidic interconnections
  • 2.4.04[Micro-] handling systems
  • 2.4.05Communication interfaces
  • 2.4.06Signal processing and algorithms
  • 2.4.10System development ATEX sensors
  • 2.4.12Hermetic feedthroughs
  • 2.4.15Hermetically sealed sensor housings
  • 2.4.20System development embedded systems
  • 2.4.25System development wireless sensor networks
  • 2.4.30Mechatronic Integration
  • 2.4.40Measurement electronics
  • 2.4.50Medical packaging
  • 2.4.60Test bench measurement engineering
  • 2.4.70Kalman filters for stochastic measurement values
  • 2.4.80Algorithms for sensor data fusion
  • 2.4.90Integration of inertial sensors to determine 2D/3D location and bearing