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CiS Forschungsinstitut
für Mikrosensorik GmbH

Konrad-Zuse-Straße 14
99099 Erfurt
Phone+49 361 663-1410
Fax+49 361 663-1413

Research, development and prototyping for the industry: customer specific concepts, design and simulation, miniaturisation and integration technologies for new optical sensors, radiation detectors, piezoresistive and capacitive MEMS. Foundry services: wafer processing, packaging, test, analytics.

Product range

S.01.01.02 Position (3D), direction, inertial systems

S.01.01.12 Roughness, coarseness

S.01.01.17 Edge Detection

S.01.01.21 Coating thickness

S.01.02.01 Force, load

S.01.02.03 Stress, strain, elongation

S.01.02.04 Pressure, absolute

S.01.02.05 Pressure (gauge) – measuring error < 0.1 %

S.01.02.07 Fine vacuum < 1 mbar

S.01.03.16 Flow

S.01.03.19 Volume flow in liquids

S.01.04.01 Temperature, with contact

S.01.05.01 Humidity, relative (gas humidity)

S.01.05.02 Humidity, absolute (gas humidity), dew point

S.01.05.05 Room climate

S.01.06.02 Photon counters

S.01.06.04 Radiation, radiated energy, density

S.01.06.05 Opacity, absorption, transmission

S.01.06.06 Optical attenuation

S.01.06.07 Scattered light absobtion

S.01.06.08 Refraction

S.01.06.09 Reflection, diffuse reflection, brightness

S.01.06.10 Fluorescence

S.01.06.11 Optical density

S.01.09.16 Blood flow

S.01.09.17 Pulse rate

S.01.09.18 Pulse oximetry, SpO2

S.01.09.21 Glucose

S.01.10.07 Carbon dioxide, CO2

S.02.02 Semiconductor strain gauges, piezoresistive

S.02.04 Piezoresistive sensing element

S.02.10 Capacitive sensing element

S.02.23 Photo cell, photo sensor

S.02.25 Optoelectronic element

S.02.35 Semiconductor temperature sensing element

S.02.40 Emitter receiver array

M.03.17.01 Spectrum analyser

D. Geometric parameter

D. Mechanical parameter

D. Dynamic parameter

D. Thermal parameter

D. Atmospheric parameter

D. Optical parameter

D. Chemical parameter

D. Medical parameter

D. Haptic parameter

D. Gas concentration

D. Microstructuring of silicon

D. Micro Systems Technologies MST, Micro-Electro-Mechanical-Systems MEMS

D. Plasma-/surface technology

D. Assembly and packaging

D.01.03.02 Component simulation, particularly with FEM

D.01.03.06 Performance verification & reliability analysis

D.01.04.01 Assembly and packaging

D.01.04.02 Packaging

D.02.01 Strain gauge technology

D.02.03 Thin film technology

D.02.04 Semiconductor technology

D.02.11 Microsystems technology MST / Micro-Electro-Mechanical-Systems MEMS

D.02.12 Microsensor technology

D.02.15 Micromechanics, microstructuring

D.02.17 Microelectronics

D.02.19 Assembly and packaging

D.02.28 Etching technology

D.02.30 Bonding

D.02.43 Prototype manufacture