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Albert-Ludwigs-Universität Freiburg
IMTEK - Institut für Mikrosystemtechnik

Georges-Köhler-Allee, Geb. 103
79110 Freiburg
Phone+49 761 203-98584
Fax+49 761 203-7222

R&D on MEMS, microoptics, microfluidics, sensors and actuators. Silicon micromachining, ASICs, thin films, assembly and packaging as well as polymer and ceramic microparts. New methods for design, simulation, testing and characterisation. Applications in life science, medicine as well as in traffic systems.

Product range

S.01.09.01 Electrochemical conductivity

S.01.09.03 Oxygen, dissolved

S.01.09.05 Ion-selective sensors, e.g. Na+, Cl-

S.01.09.08 Concentration in liquids

S.01.09.21 Glucose

S.01.09.22 Lactate

S.01.10.08 Nitrous oxides NOx

S.03.02 Semi-finished part for sensors

D. Mechanical parameter

D. Dynamic parameter

D. Caloric parameter

D. Atmospheric parameter

D. Meteorological parameter

D. Optical parameter

D. Acoustical parameter

D. Electrical or magnetic parameter

D. Chemical parameter

D. Biological parameter

D. Fluidic application

D. Thermal application

D. Ceramic material

D. Plastic and polymers

D. Casting compound, resin

D. Semi-finished part for sensors

D. Optical component

D. Housing

D. Optical lens

D. Magnetic material

D. Active component

D. Passive component

D. Semiconductor

D. Electronic sensor interface

D. General electronic HW, SW

D. Thick film technology

D. Thin film technology

D. Precision mechanics

D. Ceramic technology

D. Plastics technology

D. CMOS-technology or technology steps

D. Microstructuring of silicon

D. Micro Systems Technologies MST, Micro-Electro-Mechanical-Systems MEMS

D. Microstructuring of other material (glas, ceramic, metal, polymer)

D. Lithography (E-beam-, UV-, X-ray lithography)

D. Galvanic processing

D. Plasma-/surface technology

D. Replication technology (Injection molding, hot embossing)

D. Fiber optics

D. Microoptics, integrated optics

D. Optoelectronic integrated circuit, OEIC

D. Assembly and packaging

D. Fieldbus technology, wireless, embedded controller, FPGA

D. Micro fluidic device

D. Signal processing and algorithm

D. Software development for measurement and testing technology

D. Software development, sensor specific

D.01.03.01 Process and technology simulation

D.01.03.02 Component simulation, particularly with FEM

D.01.03.03 Analog simulation

D.01.03.04 Digital simulation

D.01.03.05 System simulation

D.01.03.06 Performance verification & reliability analysis

D.01.03.07 Optics simulation, raytracing

D.01.03.09 Magnetic field simulation

D.01.04.01 Assembly and packaging

D.01.04.02 Packaging

D.01.04.03 Fluidic interconnection

D.01.04.06 System development embedded system

D.01.04.07 System development wireless sensor network

D.01.04.09 Measurement electronics

D.01.04.10 Assembly and packaging for medical technology

D.04.06 Training, continued education

D.04.07 Training-on-the-project

D.04.10 Consulting in Micro Systems Technologies, MEMS