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Wilh.-Schickard-Straße 10
78052 Villingen-Schwenningen
Phone+49 7721 943-0
Fax+49 7721 943-210

Hahn-Schickard develops intelligent products using microsystems engineering: from the initial idea or concept through to production, in the fields of health, mobility, security and resource efficiency. The R+D serivce provider has regional roots, but is also globally in demand.

Product range

D.02.14 Microfluidics, micropneumatics

D.02.32 Micro welding

D. Digital ASIC

D. Substrate material

D. Medical parameter

D.01.04.02 Packaging

D.01.03.04 Digital simulation

D. Ceramic material

D. Geometric parameter

D. Connector

D. Housing

D. Replication technology (Injection molding, hot embossing)

D.02.08 Plastics technology

D.02.33 Micro gluing

D.02.43 Prototype manufacture

D.01.03.03 Analog simulation

D.02.01 Strain gauge technology

D. Thick film technology

D.01.02.02 Test bed development

D.02.19 Assembly and packaging

D.02.17 Microelectronics

D.02.11 Microsystems technology MST / Micro-Electro-Mechanical-Systems MEMS

D.04.06 Training, continued education

D. Signal processing and algorithm

D.02.18 Hybrid technology

D. Micro fluidic device

D.02.15 Micromechanics, microstructuring

D.02.22 Mechatronics

D.02.39 Unit contract manufacture

D. Analog circuit/ASIC

D. Microstructuring of other material (glas, ceramic, metal, polymer)

D.01.03.02 Component simulation, particularly with FEM

D. Mixed-signal ASIC

D.02.02 Thick film technology

D. Roll-to-roll (R2R) structuring

D. Atmospheric parameter

D.03.01.18 Electrical voltage

D.04.10 Consulting in Micro Systems Technologies, MEMS

S.01.05.02 Humidity, absolute (gas humidity), dew point

D. Optoelectronic integrated circuit, OEIC

D.01.03.06 Performance verification & reliability analysis

D. Precision mechanics

D. Plasma-/surface technology

D.03.02.01 Acceleration sensor calibration

D.01.04.05 Communication interface

D. Optical lens

D. Caloric parameter


D.01.03.05 System simulation

S.01.10.07 Carbon dioxide, CO2

D. Fluidic application

S.03.02 Semi-finished part for sensors

D. Ceramic technology

D.04.15 Technology consulting

D. Dynamic parameter

D.02.34 Micro cutting

D. Dynamic application (e.g. vibration damping)

D.01.04.07 System development wireless sensor network

D.01.03.01 Process and technology simulation

D.02.31 Micro drilling

S.01.03.19 Volume flow in liquids

D. Analog-to-digital converter

D. Mechanical parameter

D.02.35 Molding-, micro molding technology

S.01.03.12 Angular velocity, rotational velocity

D.02.41 Other services concerning sensor systems and actuators

D. Passive component

S.01.08.12 Electrical energy

D. Thermal parameter

D.04.12 Project planning

D.02.03 Thin film technology

D. Thin film technology

D. Electronic sensor interface

D. Active component

D.04.11 Engineering services

D.02.10 Precision mechanics

D. Thermal application

S.01.08.13 Electrical power

D.01.04.01 Assembly and packaging

D.02.30 Bonding

D. Plastics technology

D. Assembly and packaging

D.02.12 Microsensor technology

S.01.08.01 Electrical voltage

D.02.13 Microactuator technology

D.02.28 Etching technology

D.01.04.06 System development embedded system

S.01.03.13 Angular velocity, rotational acceleration

S.01.08.03 Electrical current, contactless

D.02.06 CMOS technology

D.02.07 Ceramic technology

D. Electrical or magnetic parameter

D. Fieldbus technology, wireless, embedded controller, FPGA

D. Lithography (E-beam-, UV-, X-ray lithography)

S.01.03.18 Volume flow in gases

D.02.36 Housing production

D.01.04.09 Measurement electronics

D. Positioning application

D.02.25 ASIC

D. Micro Systems Technologies MST, Micro-Electro-Mechanical-Systems MEMS

D. CMOS-technology or technology steps

D.04.13 Business consulting

D. Microstructuring of silicon

D.02.29 Galvanic processing

D. Galvanic processing

D. Plastic and polymers

D.03.02.19 Reliability testing, load testing