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duotec GmbH

Humboldtstr. 8a
58553 Halver
Germany

phone+49 2353 1390-0
fax+49 2353 1390 - 6519

emailinfo@duotec.net
urlhttps://www.duotec.net

duotec is one of the world's leading solution providers for innovative electronics, connectivity, E²MS and ODM. The company develops and manufactures specific electronic sensor solutions for a wide range of industries and has continuously expanded its expertise over the past decades. In addition to electronics development, core competencies include CoB technology, thick-film hybrid technology, and sterilizable electronics protection through autoclavable overmolding with biocompatible material.

S.01.02.01 Force, load

S.01.02.02 Mass, weight, dosage

S.01.02.03 Stress, strain, elongation

S.01.02.04 Pressure, absolute

S.01.02.06 Pressure (gauge) – measuring error ≥ 0.1 %

S.01.02.08 Extreme pressure > 1000 bar

S.01.02.10 Differential pressure – measuring error > 0.1 %

S.01.02.11 Pressure drop, leakage

S.03.05 Ceramic component

S.03.12 Ultrasound generator

S.03.13 Light source

S.03.14 Illumination system

S.03.15 LED

S.03.22 ASIC, sensor-specific

S.03.24 Hybrid circuit

S.03.25 Interface module

S.03.26 Communication module, wire-bound

S.03.27 Communication module, wireless

S.03.34 Power supply

D.01.01 General IT, software, hardware services

D.01.02.04.02 Mechanical parameter

D.01.02.04.03 Dynamic parameter

D.01.02.04.04 Thermal parameter

D.01.02.04.05 Caloric parameter

D.01.02.04.11 Electrical or magnetic parameter

D.01.02.05.03 Fluidic application

D.01.02.06.01 Ceramic material

D.01.02.06.02 Plastic and polymers

D.01.02.06.03 Casting compound, resin

D.01.02.06.04 Semi-finished part for sensors

D.01.02.07.06 Analog circuit/ASIC

D.01.02.07.07 Analog-to-digital converter

D.01.02.07.10 Electronic sensor interface

D.01.02.07.15 Data logger diagonstic system

D.01.02.08.01 Thick film technology

D.01.02.08.19 Assembly and packaging

D.01.02.08.20 Fieldbus technology, wireless, embedded controller, FPGA

D.01.02.09.01 Signal processing and algorithm

D.01.02.09.03 Software development, sensor specific

D.01.02.09.06 Automation software

D.01.03.03 Analog simulation

D.01.03.04 Digital simulation

D.01.04.01 Assembly and packaging

D.01.04.02 Packaging

D.01.04.03 Fluidic interconnection

D.01.04.05 Communication interface

D.01.04.06 System development embedded system

D.01.04.07 System development wireless sensor network

D.01.04.08 Mechatronic integration

D.01.04.09 Measurement electronics

D.01.04.10 Assembly and packaging for medical technology

D.02.01 Strain gauge technology

D.02.02 Thick film technology

D.02.07 Ceramic technology

D.02.08 Plastics technology

D.02.18 Hybrid technology

D.02.19 Assembly and packaging

D.02.24 Bus systems

D.02.25 ASIC

D.02.35 Molding-, micro molding technology

D.02.36 Housing production

D.02.41 Other services concerning sensor systems and actuators

D.02.43 Prototype manufacture

D.02.44 Electronics manufacturing service, EMS

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