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Sensor + Test

Technische Universität Hamburg-Harburg
Institut für Mikrosystemtechnik

Eißendorfer Str. 42
21073 Hamburg
Germany
phone+49 40 42878-4398
fax+49 40 42878-2396
emailtrieu@tuhh.de
urlhttp://www.tu-harburg.de/mst/

The Institute of Microsystems Technology at TU Hamburg-Harburg conducts research and development in the areas of medical engineering, micro sensors and lifesciences using an hollistic approach of modelling, process technology and system integration for the realisation of system solutions. Apart from micro implants among others highly sensitive micro mass spectrometers, micro optical interferometers for the micro analytics as well as microfluidic systems for the biosystem technology are developed. Novel sensor materials, flexible fabrication techniques and innovative energy harvesting and transponder technology characterize our works.

S.01.02.03 Stress, strain, elongation

S.01.02.04 Pressure, absolute

S.01.03.16 Flow

S.01.04.01 Temperature, with contact

S.01.04.02 Temperature, contactless

S.01.04.05 Thermal conductivity

S.01.09.03 Oxygen, dissolved

S.01.09.06 Mass spectrometer

S.01.09.15 Blood pressure, non-invasive

S.01.09.17 Pulse rate

S.01.09.18 Pulse oximetry, SpO2

S.01.09.21 Glucose

S.01.09.22 Lactate

S.01.10.02 Oxygen O, gaseous

S.02.01 Strain gauge

S.02.21 Thermocouple

M.01 Telemetry system and components

D.01.02.04.02 Mechanical parameter

D.01.02.04.03 Dynamic parameter

D.01.02.04.04 Thermal parameter

D.01.02.04.06 Atmospheric parameter

D.01.02.04.07 Meteorological parameter

D.01.02.04.12 Chemical parameter

D.01.02.04.13 Biological parameter

D.01.02.04.14 Medical parameter

D.01.02.05.03 Fluidic application

D.01.02.05.04 Thermal application

D.01.02.08.02 Thin film technology

D.01.02.08.08 Microstructuring of silicon

D.01.02.08.09 Micro Systems Technologies MST, Micro-Electro-Mechanical-Systems MEMS

D.01.02.08.10 Microstructuring of other material (glas, ceramic, metal, polymer)

D.01.02.08.13 Plasma-/surface technology

D.01.02.08.17 Microoptics, integrated optics

D.01.02.08.19 Assembly and packaging

D.01.02.09.01 Signal processing and algorithm

D.01.03.02 Component simulation, particularly with FEM

D.01.04.01 Assembly and packaging

D.01.04.02 Packaging

D.01.04.03 Fluidic interconnection

D.01.04.05 Communication interface

D.01.04.09 Measurement electronics

D.02.01 Strain gauge technology

D.02.03 Thin film technology

D.02.04 Semiconductor technology

D.02.08 Plastics technology

D.02.11 Microsystems technology MST / Micro-Electro-Mechanical-Systems MEMS

D.02.12 Microsensor technology

D.02.13 Microactuator technology

D.02.14 Microfluidics, micropneumatics

D.02.15 Micromechanics, microstructuring

D.02.16 Integrated optics, microoptics

D.02.19 Assembly and packaging

D.02.20 Nano technology

D.02.29 Galvanic processing

D.02.30 Bonding

D.02.41 Other services concerning sensor systems and actuators

D.02.42 Actuator-specific

D.02.43 Prototype manufacture

D.04.06 Training, continued education

D.04.15 Technology consulting

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