S.03.24 Hybrid circuit
S.03.35 Power supply for wireless sensors
M.07.01 Electronics general
M.07.05 Wireless signal transmission (WLAN, UMTS, telemetry, Bluetooth, etc.)
D.01.02.03 Mechatronic system engineering
D.01.02.04.13 Biological parameter
D.01.02.04.14 Medical parameter
D.01.02.07.13 General electronic HW, SW
D.01.02.08.09 Micro Systems Technologies MST, Micro-Electro-Mechanical-Systems MEMS
D.01.02.08.19 Assembly and packaging
D.01.03.01 Process and technology simulation
D.01.03.02 Component simulation, particularly with FEM
D.01.03.03 Analog simulation
D.01.03.04 Digital simulation
D.01.03.05 System simulation
D.01.03.06 Performance verification & reliability analysis
D.01.03.09 Magnetic field simulation
D.01.03.10 Electric field simulation
D.01.03.16 Further modeling and simulation
D.01.04.01 Assembly and packaging
D.01.04.02 Packaging
D.01.04.04 (Micro-) handling system
D.01.04.08 Mechatronic integration
D.01.04.10 Assembly and packaging for medical technology
D.02.02 Thick film technology
D.02.03 Thin film technology
D.02.11 Microsystems technology MST / Micro-Electro-Mechanical-Systems MEMS
D.02.12 Microsensor technology
D.02.13 Microactuator technology
D.02.14 Microfluidics, micropneumatics
D.02.17 Microelectronics
D.02.18 Hybrid technology
D.02.19 Assembly and packaging
D.02.22 Mechatronics
D.02.26 Contract manufacture
D.02.30 Bonding
D.02.39 Unit contract manufacture
D.02.43 Prototype manufacture
D.02.44 Electronics manufacturing service, EMS
D.04.10 Consulting in Micro Systems Technologies, MEMS
D.04.22 Microelectronics consulting
