S.01.02.03 Stress, strain, elongation
S.01.03.02 Wavelength, frequency
S.01.03.08 Pulse counting, event counting
S.01.03.09 Rotational speed (r.p.m)
S.01.03.10 Angular momentum
S.01.03.12 Angular velocity, rotational velocity
S.01.03.13 Angular velocity, rotational acceleration
S.01.03.20 Flow velocity
S.01.04.02 Temperature, contactless
S.01.04.03 Temperature distribution
S.01.06.01 Light intensity, illumination intensity
S.01.06.04 Radiation, radiated energy, density
S.01.06.15 Infrared, IR measurement
S.01.08.01 Electrical voltage
S.01.08.02 Electrical current, with contact
S.01.08.03 Electrical current, contactless
S.01.08.04 Electrical charge, capacity
S.01.08.05 Electrical fieldstrength, magnetic fieldstrength
S.01.08.07 Electrical conductivity
S.01.08.08 Electrical resistance
S.02.04 Piezoresistive sensing element
S.02.05 Thin film measuring cell
S.02.07 Thermoresistor
S.02.09 Inductive sensing element
S.02.10 Capacitive sensing element
S.02.12 Magneto-resistive sensing element
S.02.14 Hall sensing element
S.02.21 Thermocouple
S.02.23 Photo cell, photo sensor
S.02.25 Optoelectronic element
S.02.28 Infrared, IR measuring cell
S.02.35 Semiconductor temperature sensing element
S.03.01 Special material
S.03.03 Wafer, polished
S.03.08 Special glass
S.03.09 Protective coating
S.03.22 ASIC, sensor-specific
S.03.24 Hybrid circuit
S.03.26 Communication module, wire-bound
S.03.27 Communication module, wireless
S.03.45.02 Piezoelectric actuator
S.03.45.07 Electrostatic actuator
M.03.16.01 Spectrum analyser
M.08.12 2D-/3D-Figure analysis
D.01.02.04.08 Optical parameter
D.01.02.04.11 Electrical or magnetic parameter
D.01.02.04.12 Chemical parameter
D.01.02.04.13 Biological parameter
D.01.02.04.14 Medical parameter
D.01.02.06.06 Optical component
D.01.02.07.06 Analog circuit/ASIC
D.01.02.07.08 Digital ASIC
D.01.02.07.09 Mixed-signal ASIC
D.01.02.08.07 CMOS-technology or technology steps
D.01.02.08.08 Microstructuring of silicon
D.01.02.08.10 Microstructuring of other material (glas, ceramic, metal, polymer)
D.01.02.08.11 Lithography (E-beam-, UV-, X-ray lithography)
D.01.02.09.01 Signal processing and algorithm
D.01.03.03 Analog simulation
D.01.03.04 Digital simulation
D.01.03.05 System simulation
D.01.03.06 Performance verification & reliability analysis
D.01.04.01 Assembly and packaging
D.01.04.02 Packaging
D.01.04.05 Communication interface
D.02.04 Semiconductor technology
D.02.06 CMOS technology
D.02.11 Microsystems technology MST / Micro-Electro-Mechanical-Systems MEMS
D.02.12 Microsensor technology
D.02.15 Micromechanics, microstructuring
D.02.16 Integrated optics, microoptics
D.02.17 Microelectronics
D.02.19 Assembly and packaging
D.02.20 Nano technology
D.02.25 ASIC
D.04.06 Training, continued education
D.04.06 Training, continued education
D.04.07 Training-on-the-project
D.04.13 Business consulting
D.04.16 Consultance in financial-support programmes
