S.01.02.01 Force, load
S.01.02.02 Mass, weight, dosage
S.01.02.03 Stress, strain, elongation
S.01.02.05 Pressure (gauge) – measuring error < 0.1 %
S.01.02.06 Pressure (gauge) – measuring error ≥ 0.1 %
S.01.02.08 Extreme pressure > 1000 bar
S.01.03.16 Flow
S.01.03.17 Mass flow
S.01.03.18 Volume flow in gases
S.01.03.19 Volume flow in liquids
S.01.03.20 Flow velocity
S.01.04.01 Temperature, with contact
S.02.01 Strain gauge
S.02.03 Resistive sensor element
S.02.05 Thin film measuring cell
S.02.06 Thick film measuring cell
S.02.07 Thermoresistor
S.02.21 Thermocouple
S.02.28 Infrared, IR measuring cell
D.01.02.06.13 Electrical resistor
D.01.02.07.03 Passive component
D.01.02.08.02 Thin film technology
D.01.02.08.08 Microstructuring of silicon
D.01.02.08.10 Microstructuring of other material (glas, ceramic, metal, polymer)
D.01.02.08.14 Low Temperature Cofired Ceramics, LTCC
D.01.03.02 Component simulation, particularly with FEM
D.02.01 Strain gauge technology
D.02.03 Thin film technology
D.02.11 Microsystems technology MST / Micro-Electro-Mechanical-Systems MEMS
D.02.12 Microsensor technology
D.02.27 Laser processing
D.02.28 Etching technology
D.02.30 Bonding