ifw - Günter-Köhler-Institut
für Fügetechnik und Werkstoffprüfung GmbH

Ernst-Ruska-Ring 3
07745 Jena
Germany
phone+49 3641 2041-00
fax+49 3641 2041-10

Research archievements and manufacturing service to structure assembling and connection techniques for microsystems; development and manufacturing of customized opto-electronics elements, thick film technologies, micro joining process, sensor development within the range acceleration, pressure, strength, and flow rate; production of sensor elements (acceleration, flow, strength, optoelectronic devices).

S.01.01.03 Length, displacement – range < 0.01 m

S.01.06.01 Light intensity, illumination intensity

S.01.06.04 Radiation, radiated energy, density

S.01.06.05 Opacity, absorption, transmission

S.01.06.06 Optical attenuation

S.01.06.11 Optical density

S.01.06.15 Infrared, IR measurement

S.01.06.16 UV measurement

S.02.03 Resistive sensor element

S.02.05 Thin film measuring cell

S.02.23 Photo cell, photo sensor

S.02.24 Fibre-optic sensor

S.02.25 Optoelectronic element

S.02.27 UV measuring cell

S.02.28 Infrared, IR measuring cell

M.08.01 Image processing, general

M.09.05.01.01 Tensile, pressure, bending

M.09.05.01.02 Shearing

M.09.05.02.01 Static

M.09.05.02.02 Quasi-static / continuous

M.09.05.02.03 dynamic / intermittent

M.09.05.02.04 dynamic / cyclical

M.09.05.03.01 Mass force (static, dynamic)

M.09.05.03.02 Electromechanical

M.09.05.03.03 Servo-hydraulic, servo-pneumatic

M.09.05.04.01 Static hardness testing per depth measurement

M.09.05.04.02 Instrumented hardness determination

M.09.05.05.09 Liquid penetration testing system

M.09.05.07.06 Climatic test chamber (temperature, humidity, material moisture)

M.09.05.07.13 Dye penetration testing systems

M.09.06.01.01 Ultrasonic processes

M.09.06.01.02 Radioscopy / Fluoroscopy

M.09.06.01.03 X-ray inspection

M.09.06.01.05 Image analysis

M.09.06.01.12 Electron microscopy (SEM)

M.09.06.02.01 Volume - error

M.09.06.02.02 Wall thickness

M.09.06.02.04 Surface - error

M.09.06.02.05 Surface - roughness

M.09.06.02.07 Surface - layer thickness

M.09.06.06.02 Emission spectral analysis measuring and testing device

M.09.06.06.06 Further measuring and testing technology for chemical material testing

D.01.02.04.08 Optical parameter

D.01.03.01 Process and technology simulation

D.01.03.02 Component simulation, particularly with FEM

D.01.03.11 Fluid simulation

D.01.03.14 Physics simulation

D.01.04.01 Assembly and packaging

D.02.03 Thin film technology

D.02.11 Microsystems technology MST / Micro-Electro-Mechanical-Systems MEMS

D.02.15 Micromechanics, microstructuring

D.02.19 Assembly and packaging

D.02.21 Additive manufacturing (3D printing)

D.02.27 Laser processing

D.02.28 Etching technology

D.02.31 Micro drilling

D.02.32 Micro welding

D.02.41 Other services concerning sensor systems and actuators

D.02.52 Additive manufacturing (3D printing)

D.03.02.29 Materials analysis with X-ray fluorescence, XRF

D.03.02.30 Energy-dispersive X-ray spectroscopy, EDX, EDS