Sensitec GmbH

Schanzenfeldstr. 2
35578 Wetzlar
Germany
phone+49 6441 52910
fax+49 6441 5291117

Sensor solutions based on magnetoresistive effect for measurement of angle, path, position, current or magnetic field - simply robust, precise and dynamic. From components to complete system solu-tions "made in Germany". For applications in industrial automation, medical technology, automotive, measurement technology, drive systems, aerospace, machine tools and others.

S.01.01.01 Angle, inclination, orientation

S.01.01.03 Length, displacement – range < 0.01 m

S.01.01.04 Length, displacement – range < 0.5 m

S.01.01.05 Length, displacement – range ≥ 0.5 m

S.01.01.08 Position (2D/3D)

S.01.01.09 Position (piston)

S.01.01.17 Edge Detection

S.01.01.23 Gap width

S.01.01.25 Proximity switch

S.01.01.28 Limit switch, position switch

S.01.01.29 Magnetic switch, general

S.01.01.30 Magnetic switch, cog sensor

S.01.02.19 Torque

S.01.02.20 Moment of torsion, reaction moment

S.01.03.09 Rotational speed (r.p.m)

S.01.03.11 Rotational direction

S.01.05.16 Geomagnetic field, compass

S.01.08.03 Electrical current, contactless

S.01.08.05 Electrical fieldstrength, magnetic fieldstrength

S.02.03 Resistive sensor element

S.02.12 Magneto-resistive sensing element

S.03.11 Permanent magnet

S.03.22 ASIC, sensor-specific

M.04.03 Dynamic parameter

M.04.16 Vibration measuring device

M.05.04.15 Further measurement systems with integrated signal conditioning

M.07.03 Bus system and interface

M.09.01.01.01 Exhaust gas testing equipment or testbed

M.09.01.01.02 Chassis dynamometer

M.09.06.01.06 Electromagnetic process, eddy current process

M.09.06.02.01 Volume - error

M.09.06.02.04 Surface - error

M.09.06.05.05 Oscillation monitoring device and system

D.01.02.07.13 General electronic HW, SW

D.01.02.08.09 Micro Systems Technologies MST, Micro-Electro-Mechanical-Systems MEMS

D.01.04.01 Assembly and packaging

D.01.04.06 System development embedded system

D.02.11 Microsystems technology MST / Micro-Electro-Mechanical-Systems MEMS

D.02.30 Bonding

D.02.41 Other services concerning sensor systems and actuators