S.03.01 Special material
S.03.04 Ceramic raw material
S.03.05 Ceramic component
S.03.07 Thickfilm paste
S.03.16 Laser System
S.03.20 Optical fibre cable
S.03.21 Electrical feedthrough
S.03.24 Hybrid circuit
S.03.30 Hermetically sealed housing
S.03.31 Connector
S.03.32 PCB
S.04.01 Exposure equipment
S.04.02 Equipment for photolithography
S.04.03 Dosing device
S.04.04 Diffusion tube
S.04.06 Coating system
S.04.07 Laser scoring, cutting and trimming system
S.04.08 Cleaning equipment
S.04.09 Etching equipment
S.04.10 Wafer saw
S.04.11 Equipment for desiccation, drying; tunnel furnace
S.04.12 Bonding equipment
S.04.13 Resistance soldering / welding equipment
S.04.15 Clean-room equipment
S.04.16 Flow box
S.04.17 ESD equipment
S.04.18 Laser welding system
M.09.05.01.01 Tensile, pressure, bending
M.09.05.01.02 Shearing
M.09.05.01.03 Torsion
M.09.05.01.04 Combined / multi-axial
M.09.05.01.05 Experimental stress analysis
M.09.05.02.01 Static
M.09.05.02.02 Quasi-static / continuous
M.09.05.02.03 dynamic / intermittent
M.09.05.02.04 dynamic / cyclical
M.09.05.02.05 dynamic / random
M.09.05.03.01 Mass force (static, dynamic)
M.09.05.03.04 Resonance stimulation
M.09.05.03.05 Drop energy (striking / drop-impact mechanism)
M.09.05.04.01 Static hardness testing per depth measurement
M.09.05.05.06 Viscosimeter
M.09.05.07.06 Climatic test chamber (temperature, humidity, material moisture)
M.09.05.07.10 Moisture content testing system
M.09.06.01.01 Ultrasonic processes
M.09.06.01.03 X-ray inspection
M.09.06.01.06 Electromagnetic process, eddy current process
M.09.06.01.08 Optical 3-D measuring process, dimension testing system
M.09.06.01.10 Thermal imaging
M.09.06.01.12 Electron microscopy (SEM)
M.09.06.02.01 Volume - error
M.09.06.02.02 Wall thickness
M.09.06.02.04 Surface - error
M.09.06.02.05 Surface - roughness
M.09.06.02.06 Surface - topography
M.09.06.02.07 Surface - layer thickness
M.09.06.02.08 Surface - deformation
D.01.02.08.01 Thick film technology
D.01.02.08.02 Thin film technology
D.01.02.08.04 Ceramic technology
D.01.02.08.05 Plastics technology
D.01.02.08.09 Micro Systems Technologies MST, Micro-Electro-Mechanical-Systems MEMS
D.01.02.08.10 Microstructuring of other material (glas, ceramic, metal, polymer)
D.01.02.08.11 Lithography (E-beam-, UV-, X-ray lithography)
D.01.02.08.12 Galvanic processing
D.01.02.08.13 Plasma-/surface technology
D.01.02.08.14 Low Temperature Cofired Ceramics, LTCC
D.01.02.08.15 Replication technology (Injection molding, hot embossing)
D.01.02.08.16 Fiber optics
D.01.02.08.17 Microoptics, integrated optics
D.01.02.08.18 Optoelectronic integrated circuit, OEIC
D.01.02.08.19 Assembly and packaging
D.01.02.08.22 Photoresist processing
D.01.02.08.23 Photomask
D.01.02.09.06 Automation software
D.01.03.01 Process and technology simulation
D.01.03.02 Component simulation, particularly with FEM
D.01.03.03 Analog simulation
D.01.03.04 Digital simulation
D.01.03.05 System simulation
D.01.03.06 Performance verification & reliability analysis
D.01.03.07 Optics simulation, raytracing
D.01.03.12 Micro optics, diffractive optics
D.01.04.01 Assembly and packaging
D.01.04.02 Packaging
D.01.04.03 Fluidic interconnection
D.01.04.04 (Micro-) handling system
D.01.04.05 Communication interface
D.01.04.06 System development embedded system
D.01.04.07 System development wireless sensor network
D.01.04.08 Mechatronic integration
D.01.04.09 Measurement electronics
D.01.04.10 Assembly and packaging for medical technology
D.01.04.11 Development/manufacture of Hall Sensor EOL Tester
D.01.04.12 Integration of sensor technology in clamping system
D.01.04.13 Integration of inertial sensors to determine 2D/3D location and bearing
D.01.04.14 Sensor integration in downhole- and subsea housings
D.01.04.15 Further system integration
D.02.02 Thick film technology
D.02.03 Thin film technology
D.02.07 Ceramic technology
D.02.08 Plastics technology
D.02.09 Fiber optics
D.02.16 Integrated optics, microoptics
D.02.18 Hybrid technology
D.02.19 Assembly and packaging
D.02.20 Nano technology
D.02.22 Mechatronics
D.02.23 Adaptronics
D.02.27 Laser processing
D.02.28 Etching technology
D.02.29 Galvanic processing
D.02.30 Bonding
D.02.31 Micro drilling
D.02.32 Micro welding
D.02.33 Micro gluing
D.02.35 Molding-, micro molding technology
D.02.36 Housing production
D.02.37 Connector, cable technologies
D.02.38 Peripherals technology
D.02.39 Unit contract manufacture
D.02.40 Cleaning/Activating
D.02.41 Other services concerning sensor systems and actuators
D.02.42 Actuator-specific
D.02.43 Prototype manufacture
D.02.44 Electronics manufacturing service, EMS
D.02.49 Photo lithography and embossing
D.02.51 Multilayer coating
D.03.02.15 Vibration, shock and climatic Tests
D.03.02.18 Quality testing, quality assurance
D.03.02.19 Reliability testing, load testing
D.03.02.20 X-Ray inspection
D.03.02.21 X-Ray, 2D/3D
D.04.10 Consulting in Micro Systems Technologies, MEMS
D.04.13 Business consulting
D.04.15 Technology consulting
