S.01.01.10 Contour (2D/3D)
S.01.01.11 Topography
S.01.01.12 Roughness, coarseness
S.01.01.18 Particle size
S.01.01.21 Coating thickness
S.01.02.14 Viscosity
S.01.02.15 Hardness, elasticity
S.01.03.09 Rotational speed (r.p.m)
S.01.03.16 Flow
S.01.03.19 Volume flow in liquids
S.01.04.01 Temperature, with contact
S.01.04.02 Temperature, contactless
S.01.08.01 Electrical voltage
S.01.08.02 Electrical current, with contact
S.01.08.04 Electrical charge, capacity
S.01.08.07 Electrical conductivity
S.01.08.08 Electrical resistance
S.01.08.12 Electrical energy
S.01.08.13 Electrical power
S.01.10.02 Oxygen O, gaseous
S.02.01 Strain gauge
S.02.03 Resistive sensor element
S.02.10 Capacitive sensing element
M.02 Modeling and simulation, HiL
M.03.01 Multimeter
M.03.02 Oscilloscope
M.03.09 Force-displacement measuring equipment
M.03.15 Thermal imaging camera
M.05.01.01.02 0.5 to 4.5 V
M.05.01.02.01 0 to 20 mA
M.05.01.02.02 4 to 20 mA
M.05.03.05 Automation (Profibus, Interbus, Ethernet, EtherCAT, openSAFETY, etc.)
M.05.03.06 OPC UA
M.05.03.07 HART, IO-Link
M.05.03.08 ProfiNET, Ethernet/IP
M.05.03.13 Network protocols
M.05.03.14 USB, SPI, I²C
M.05.04.01 Thermocouple
M.06.03 Simulation
M.06.07 Programming environment
M.06.08 Automation software
M.07.01 Electronics general
M.07.04 Cables, connectors, accessories for digital signal transmission
M.07.05 Wireless signal transmission (WLAN, UMTS, telemetry, Bluetooth, etc.)
M.08.01 Image processing, general
M.08.03 Object detection, object comparison
M.08.05 Object measurement
M.08.12 2D-/3D-Figure analysis
M.09.01.01.10 Climatic testbed
M.09.03.09 Further testing systems for electronics and electrical engineering
M.09.04.05 Medicine
M.09.05.01.01 Tensile, pressure, bending
M.09.05.02.01 Static
M.09.05.02.04 dynamic / cyclical
M.09.05.04.01 Static hardness testing per depth measurement
M.09.05.06.02 Force transducer
M.09.05.06.06 Grip, chuck, fixture
M.09.06.01.01 Ultrasonic processes
M.09.06.01.04 SFM (scanning force microscopy)
M.09.06.01.05 Image analysis
M.09.06.01.06 Electromagnetic process, eddy current process
M.09.06.01.07 AOI (automatic optical inspection)
M.09.06.01.12 Electron microscopy (SEM)
M.09.06.01.14 Thermal shock test air/air, air/liquid, liquid/liquid
M.09.06.03.03 Hardware-in-the-Loop simulation, HIL
M.09.06.03.04 Finite Element Calculation, FEM
M.09.06.03.05 Kinematics simulation
M.09.06.03.07 Lifetime assessment
M.09.06.03.08 Further quality testing and calculation validation
M.09.06.06.04 Raman spectrometer
D.01.01 General IT, software, hardware services
D.01.02.01 Measurement techniques and processes
D.01.02.02 Test bed development
D.01.02.03 Mechatronic system engineering
D.01.02.04.11 Electrical or magnetic parameter
D.01.02.06.01 Ceramic material
D.01.02.06.04 Semi-finished part for sensors
D.01.02.06.10 3D-MID
D.01.02.08.13 Plasma-/surface technology
D.01.02.08.19 Assembly and packaging
D.01.02.09.06 Automation software
D.01.02.09.07 Software development for cybersecurity
D.01.03.01 Process and technology simulation
D.01.03.02 Component simulation, particularly with FEM
D.01.03.05 System simulation
D.01.03.06 Performance verification & reliability analysis
D.01.03.07 Optics simulation, raytracing
D.01.03.08 HiL Hardware-in-the-Loop simulation
D.01.03.09 Magnetic field simulation
D.01.03.10 Electric field simulation
D.01.03.11 Fluid simulation
D.01.04.01 Assembly and packaging
D.01.04.02 Packaging
D.01.04.03 Fluidic interconnection
D.01.04.04 (Micro-) handling system
D.01.04.05 Communication interface
D.01.04.06 System development embedded system
D.01.04.07 System development wireless sensor network
D.01.04.08 Mechatronic integration
D.01.04.09 Measurement electronics
D.01.04.10 Assembly and packaging for medical technology
D.02.17 Microelectronics
D.02.19 Assembly and packaging
D.02.21 Additive manufacturing (3D printing)
D.02.22 Mechatronics
D.02.27 Laser processing
D.02.30 Bonding
D.02.44 Electronics manufacturing service, EMS
D.02.52 Additive manufacturing (3D printing)
D.02.56 3D structural electronics production
D.03.02.29 Materials analysis with X-ray fluorescence, XRF
D.03.02.30 Energy-dispersive X-ray spectroscopy, EDX, EDS
D.04.01 Measuring service
D.04.04 Automation system design
D.04.06 Training, continued education
D.04.12 Project planning
D.04.13 Business consulting
D.04.15 Technology consulting
D.04.16 Consultance in financial-support programmes
D.04.18 Standards, norms
D.04.21 Studies and expert reports
D.04.22 Microelectronics consulting
D.04.23 Further general contracting services
