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Technische Universität Berlin
Sekr. TIB 4/2-1

Gustav-Meyer-Allee 25
13355 Berlin
Germany
phone+49 30 314-72882
fax+49 30 314-72835

The Research Center Microperipheric Technologies of the TU Berlin develops packa-ging concepts for sensors and miniaturized systems. Beside the integration of sen-sors and MEMS the center focusses on packaging for wireless, RF and optical sys-tems. Experts in the field of design, reliability and environmental issues are in-tegrated in the R&D work.

D.01.02.08.02 Thin film technology

D.01.02.08.08 Microstructuring of silicon

D.01.02.08.09 Micro Systems Technologies MST, Micro-Electro-Mechanical-Systems MEMS

D.01.02.08.10 Microstructuring of other material (glas, ceramic, metal, polymer)

D.01.02.08.12 Galvanic processing

D.01.02.08.16 Fiber optics

D.01.02.08.17 Microoptics, integrated optics

D.01.02.08.19 Assembly and packaging

D.01.02.08.21 Micro fluidic device

D.01.02.08.24 Plasmonics

D.01.03.01 Process and technology simulation

D.01.03.02 Component simulation, particularly with FEM

D.01.03.06 Performance verification & reliability analysis

D.01.03.07 Optics simulation, raytracing

D.01.03.09 Magnetic field simulation

D.01.03.10 Electric field simulation

D.01.03.12 Micro optics, diffractive optics

D.01.04.01 Assembly and packaging

D.01.04.02 Packaging

D.01.04.06 System development embedded system

D.01.04.07 System development wireless sensor network

D.01.04.10 Assembly and packaging for medical technology

D.01.04.13 Integration of inertial sensors to determine 2D/3D location and bearing

D.01.04.14 Sensor integration in downhole- and subsea housings

D.04.10 Consulting in Micro Systems Technologies, MEMS

D.04.15 Technology consulting

D.04.22 Microelectronics consulting